{"title":"Sensitivity of output response to geometrical dimensions in VLSI interconnects","authors":"Agnieszka Ligocka-Wardzinska, W. Bandurski","doi":"10.1109/SPI.2009.5089863","DOIUrl":null,"url":null,"abstract":"The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.","PeriodicalId":309546,"journal":{"name":"2009 IEEE Workshop on Signal Propagation on Interconnects","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2009.5089863","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The paper presents a sensitivity analysis of step and ramp response of VLSI interconnects to geometrical dimensions of microstrip model of higher level interconnects. The method is based on analytical form of VLSI output response calculated using multiple scales method.