Warpage detection during baking of semiconductor substrate in microlithography

W. Ho, A. Tay, K. Lim, Ying Zhou, Kai Yang
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引用次数: 1

Abstract

Wafer warpage is common in microelectronics processing. Warped wafers can affect driven performance, reliability and linewidth control in various processing steps. We proposed in this paper an in-situ fault detection technique for wafer warpage in microlithography. Early detection can minimize cost and processing time. Based on first principle thermal modeling, we are able to detect warpage fault from available temperature measurements. Experimental results demonstrate the feasibility of the approach. The proposed approach is applicable to other semiconductor substrates.
微光刻中半导体衬底烘烤过程中的翘曲检测
晶圆翘曲在微电子加工中很常见。翘曲的晶圆会影响驱动性能、可靠性和在各个加工步骤中的线宽控制。本文提出了一种微光刻中晶圆翘曲的原位故障检测技术。早期检测可以将成本和处理时间降至最低。基于第一性原理热建模,我们能够从可用的温度测量中检测翘曲故障。实验结果证明了该方法的可行性。所提出的方法适用于其他半导体衬底。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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