A Low Cost Packaging Solution for Microwave Applications

Abstract

Lower cost solutions for packaging GaAs pHEMT devices, MMIC's and multi chip modules (MCM's) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed