Ballast: Implementation of a Large MP-SoC on 22nm ASIC Technology

Antti Rautakoura, Timo D. Hämäläinen, A. Kulmala, Tero Lehtinen, Mehdi Duman, Mohamed Ibrahim
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引用次数: 2

Abstract

Chips have become the critical asset of the technology, and increasing effort is put to design System-on-Chips (SoC) faster and more affordable. Typically the focus of the research has been on the Power, Performance and Area optimization of the specific component or sub-system. To improve the situation we report design effort for complex SoC counted from specification to ASIC tape-out to lay out a solid reference for the community. Ballast is the first SoC-Hub chip taped out on 22nm technology. It includes six sub-systems on 15 mm2area and reaches 1.2GHz top speed. The design team included 24 persons and spent 21 200 person hours to tape-out in one calendar year from scratch. This is an outstanding achievement and sets the baseline to SoC design productivity development.
镇流器:在22nm ASIC技术上实现大型MP-SoC
芯片已经成为这项技术的关键资产,越来越多的人致力于更快、更经济地设计片上系统(SoC)。通常,研究的重点是特定组件或子系统的功率、性能和面积优化。为了改善这种情况,我们报告了从规格到ASIC带出的复杂SoC的设计工作,为社区提供了坚实的参考。镇流器是首款采用22nm技术的SoC-Hub芯片。它包括6个子系统,面积为15 mm2,最高速度达到1.2GHz。设计团队24人,用了21 200个工时,在一年的时间里从零开始完成。这是一项杰出的成就,并为SoC设计生产力的发展设定了基准。
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