Parameter Characterization of Power MOSFET Gate Oxide Degradation Based on Current Falling Time during Turn-off Process

Guoqing Xu, Shaohua Zhao, Weiwei Wei
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Abstract

Power MOSFET is an indispensable key component in circuits and electronic systems. For power MOSFET, gate oxide degradation often occurs in various applications, so the research on gate oxide degradation has important theoretical significance for the reliability evaluation of electronic components. This paper proposes a power MOSFET gate oxide degradation parameter characterization technique based on the current fall time (tfi) during the turn-off process. Firstly, it introduces the failure mechanism and effects of gate oxide degradation of power MOSFET; secondly, analyzes the mechanism of gate oxide degradation based on the current drop time during turn-off; finally, an accelerated gate oxide degradation experiment was taken, and the results proved that the current fall time can effectively characterize the degradation state of the gate oxide layer of the power MOSFET, and verified the effectiveness of the proposed parameter characterization technique.
基于关断过程电流下降时间的功率MOSFET栅极氧化物降解参数表征
功率MOSFET是电路和电子系统中不可缺少的关键元件。对于功率MOSFET而言,栅极氧化物降解在各种应用中经常发生,因此研究栅极氧化物降解对于电子元件可靠性评估具有重要的理论意义。本文提出了一种基于关断过程中电流下降时间(tfi)的功率MOSFET栅极氧化物降解参数表征技术。首先介绍了功率MOSFET栅氧化退化的失效机理和影响;其次,分析了基于关断时电流下降时间的栅极氧化物降解机理;最后进行了栅极氧化层加速降解实验,结果证明电流下降时间可以有效表征功率MOSFET栅极氧化层的降解状态,验证了所提出参数表征技术的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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