Wide bandgap semiconductor electronic devices for high frequency applications

R. Trew, M. Shin, V. Gatto
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引用次数: 17

Abstract

The microwave performance of electronic devices fabricated from SiC and GaN is described. The investigation makes use of theoretical simulations and the results are compared to experimental measurements. Excellent agreement between the simulated and measured data is obtained. It is demonstrated that microwave power amplifiers fabricated from SiC and GaN based semiconductors offer superior RF power performance, particularly at elevated temperature compared to comparable components fabricated from GaAs MESFET's. In particular, room temperature RF output power on the order of 4 W/mm with power-added efficiency approaching the ideal values for class A and B operation is available. These devices are likely to find application in power amplifiers for base station transmitters for cellular telephone systems, power modules for phased-array radars, and other applications. The devices are particularly attractive for applications that require operation at elevated temperature.
用于高频应用的宽带隙半导体电子器件
介绍了由碳化硅和氮化镓制成的电子器件的微波性能。研究利用理论模拟,并将结果与实验测量结果进行了比较。仿真结果与实测数据吻合良好。研究表明,与由GaAs MESFET制造的同类元件相比,由SiC和GaN基半导体制造的微波功率放大器具有优越的射频功率性能,特别是在高温下。特别是,室温射频输出功率约为4 W/mm,功率附加效率接近A类和B类工作的理想值。这些器件很可能应用于蜂窝电话系统基站发射机的功率放大器、相控阵雷达的功率模块和其他应用。该设备对于需要在高温下操作的应用特别有吸引力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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