Gate leakage current analysis in READ/WRITE/ IDLE states of a SRAM cell

V. Mukherjee, S. Mohanty, E. Kougianos, Rahul Allawadhi, R. Velagapudi
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引用次数: 2

Abstract

The increasing market demand for ever smaller and application packed portable electronic devices has been fueling the relentless scaling of the CMOS transistor. The ITRS roadmap envisages that high performance CMOS circuits will require ultra-low gate oxide thickness to overcome the effects of shorter channel lengths. However, such devices will be susceptible to a more profound leakage mechanism due to carrier tunneling through the gate oxide. Consequently, the gate oxide tunneling current has emerged as the major component of the leakage power consumption of nanoscale CMOS devices. In the case of an important CMOS circuit like Static RAM (SRAM) there is a high probability for the leakage currents to be manifested with more prominence. SRAMs form a vital component of the CPU cache therefore there is a critical need for analysis, explanation, and characterization of the various tunneling mechanisms SRAMs. This paper explores the gate leakage current scenarios in the READ, WRITE and IDLE states of the SRAM which can make significant contribution to modeling and reduction of gate leakage in SRAM circuits.
SRAM单元在READ/WRITE/ IDLE状态下的栅漏电流分析
市场对体积更小、应用更广泛的便携式电子设备的需求不断增长,推动了CMOS晶体管的不断扩大。ITRS路线图设想高性能CMOS电路将需要超低栅极氧化物厚度来克服较短通道长度的影响。然而,由于载流子隧穿栅极氧化物,这种器件将容易受到更深刻的泄漏机制的影响。因此,栅极氧化物隧道电流已成为纳米级CMOS器件泄漏功耗的主要组成部分。对于像静态RAM (SRAM)这样重要的CMOS电路,泄漏电流很有可能表现得更加突出。sram是CPU缓存的重要组成部分,因此非常需要对sram的各种隧道机制进行分析、解释和表征。本文探讨了SRAM在READ, WRITE和IDLE状态下的栅极漏电流场景,这对SRAM电路的栅极漏电流建模和减少有重要贡献。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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