Flash evaporated layers of (Bi/sub 2/Te/sub 3/-Bi/sub 2/Se/sub 3/)(N) and (Bi/sub 2/Te/sub 3/-Sb/sub 2/Te/sub 3/)(P) used as micro-module-Peltier

A. Foucaran, A. Sackda, A. Giani, F. Pascal-Delannoy, A. Boyer
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引用次数: 6

Abstract

(Bi/sub 2/Te/sub 3/)/sub 0.9/(Bi/sub 2/Se/sub 3/)/sub 0.1/ for n type material powder and (Bi/sub 2/Te/sub 3/)/sub 0.25/(Sb/sub 2/Te/sub 3/)/sub 0.75/ for p type material powder were evaporated by flash evaporation technique. We obtained a value of Z equal to 0.21/spl times/10/sup -4/ K/sup -1/ for /spl alpha/=40 /spl mu/V/K and /spl rho/=50 /spl mu//spl Omega/.m for p type material and Z about 0.17/spl times/10/sup -3/ K/sup -1/ for a=90 /spl mu/V/K and /spl rho/=30 /spl mu//spl Omega/.m for n type material (at 300K), for 1 /spl mu/m layers thickness deposited over polyimide substrate, before annealing. We show that after annealing at 250/spl deg/C under He atmosphere, the figure of merit of the layers increases to Z=3.2/spl times/10/sup -3/ K/sup -1/ for /spl alpha/=240 /spl mu/V/K and /spl rho/=12 /spl mu//spl Omega/.m for p type material and Z=1.6x10/sup -3/ K/sup -1/ for /spl alpha/=200 /spl mu/V/K and /spl rho/=15 /spl mu//spl Omega/.m for n type material (at 300 K). With these fabrication parameters we realised three different structures of micro-module Peltier (MMP) junctions and we obtained a maximum value for temperature drop between hot and cold sides of about 3.4 K. This result is very promising in order to develop micro-module Peltier (MMP) effects.
(Bi/sub - 2/Te/sub - 3/-Bi/sub - 2/Se/sub - 3/)(N)和(Bi/sub - 2/Te/sub - 3/-Sb/sub - 2/Te/sub - 3/)(P)的闪蒸层作为微模块peltier
采用闪蒸法蒸发n型材料粉末(Bi/sub 2/Te/sub 3/)/sub 0.9/(Bi/sub 2/Se/sub 3/)/sub 0.1/和p型材料粉末(Bi/sub 2/Te/sub 3/)/sub 0.25/(Sb/sub 2/Te/sub 3/)/sub 0.75/。对于/spl alpha/=40 /spl mu/V/K和/spl rho/=50 /spl mu//spl Omega/,我们得到的Z值等于0.21/spl乘以/10/sup -4/ K/sup -1/。对于p型材料,m约为0.17/spl倍/10/sup -3/ K/sup -1/,对于a=90 /spl mu/V/K和/spl rho/=30 /spl mu//spl Omega/。m为n型材料(在300K时),为1 /spl mu/m层厚度沉积在聚酰亚胺衬底上,退火前。结果表明,在He气氛下,在250/spl℃退火后,对于/spl alpha/=240 /spl mu/V/K和/spl rho/=12 /spl mu//spl Omega/,层的优值值增加到Z=3.2/spl倍/10/sup -3/ K/sup -1/。m表示p型材料,Z=1.6 × 10/sup -3/ K/sup -1/表示/spl alpha/=200 /spl mu/V/K和/spl rho/=15 /spl mu//spl Omega/。利用这些制造参数,我们实现了三种不同结构的微模块Peltier (MMP)结,并获得了冷热侧之间的最大温度降约3.4 K。这一结果对开发微模块珀尔帖(MMP)效应具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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