Effects of thermosonic bonding parameters on flip chip LEDs

Abstract

The effects of thermosonic bonding parameters on GaN-based light emitting diodes (LEDs) with flip chip structure were investigated. Experiments with different thermosonic bonding parameters were conducted to optimize the flip chip process during production flow. These thermosonic bonding parameters on LEDs involved different bonding temperatures, different bonding force, and different ultrasonic power. This paper represents these parameters' effects on flip chip bonding strength by thermosonic gold ball bonding