Development of a two-tap time-resolved CMOS lock-in pixel image sensor with high charge storability and low temporal noise

M. Seo, S. Kawahito
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引用次数: 1

Abstract

A high charge storability and low noise performance are both of the significant parameters for the high sensitivity time-resolved (TR) CMOS image sensors (CISs). To achieve these, we have developed the high performance TR lock-in pixel CIS embedded with two in-pixel storage-diodes (SDs). For fast charge transfer from photodiode (PD) to SDs, a lateral electric field charge modulator (LEFM) is used for the developed lock-in pixel. As a result, the time-resolved CIS achieves a very large SD-FWC of approximately 7ke-, low temporal noise of 1.2e-rms at 20fps with true correlated double sampling (CDS) operation, and fast intrinsic response less than 500ps at 635nm. The proposed TR imager has an effective pixel array of 128(H)×256(V) and a pixel size of 11.2×11.2μm2. The sensor chip is fabricated by Dongbu HiTek 1-poly 4-metal 0.11-μm CIS process technology.
具有高电荷存储性和低时间噪声的双抽头时间分辨CMOS锁相像素图像传感器的研制
高电荷存储性能和低噪声性能是高灵敏度时间分辨CMOS图像传感器的重要参数。为了实现这些目标,我们开发了高性能TR锁定像素CIS,嵌入了两个像素内存储二极管(sd)。为了从光电二极管(PD)到SDs的快速电荷转移,在开发的锁定像素中使用了侧向电场电荷调制器(LEFM)。因此,时间分辨CIS在20fps下实现了大约7ke-的SD-FWC,在真正的相关双采样(CDS)操作下实现了1.2e-rms的低时间噪声,在635nm下实现了小于500ps的快速内在响应。所提出的TR成像仪的有效像素阵列为128(H)×256(V),像素大小为11.2×11.2μm2。传感器芯片采用东部HiTek 1-poly - 4-metal 0.11 μm CIS工艺技术制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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