3DIC from concept to reality

Abstract

3DIC technology presents a new system integration strategy for the electronics industry to achieve superior system performance with lower power consumption, higher bandwidth, smaller system form factor, and shorter time to market through heterogeneous integration. TSMC's “Chip-on-Wafer-on-Substrate (CoWoS)” technology opens up a new opportunity to bring 3D chip stacking vision from concept to reality. The provided methodology will be discussed about this market trend and the different pieces needed to jointly make it a success, which includes customers' required application, TSMC's support design flow, as well as the ecosystem design enablement of multi-die implementation, DFT solution, thermal analysis, verification and new categories of IPs.