Developing a new pressure measurement mechanism based on squeeze film damping effect

Abstract

This paper introduces a novel approach for measuring low pressures based on MEMS technology. In this technique the mechanism of squeeze film damping is used. A voltage is applied to a fixed-fixed MEMS beam and its step response is obtained; for each pressure there is a different response. Then the settling time is measured and we can relate each settling time with a defined pressure. Here, first we use some equations to relate pressure with the squeeze film damping effect; after that we use a micro beam model and relate its parameters with pressure. Then we use numerical analysis and simulation to show the procedure of pressure measuring. All simulation results are shown and discussed.