Electromagnetic modeling of package parasitics in SAW-duplexer

T. Makkonen, V. Plessky, S. Kondratiev, M. Salomaa
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引用次数: 20

Abstract

We model the inductive and capacitive parasitic electromagnetic couplings in a packaged surface-acoustic wave (SAW) antenna duplexer. Theoretical estimates for self- and mutual inductances of the bond wires are computed in the presence of two ground planes. An equivalent circuit for the duplexer including the parasitic elements is presented. The frequency response of the duplexer is predicted with the help of circuit simulation. The modeling is further refined with optimization of the model parameters to improve the fit between the measured and simulated responses.
saw双工器封装寄生的电磁建模
本文对封装声表面波(SAW)天线双工器中的电感式和电容式寄生电磁耦合进行了建模。在存在两个接地面的情况下,计算了键合线的自感和互感的理论估计。提出了一种包含寄生元件的双工器等效电路。通过电路仿真,预测了双工器的频率响应。通过对模型参数的优化,进一步完善了模型,提高了实测响应与模拟响应的拟合程度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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