Analysis of dynamic behavior of solder reflow by solder ball test

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI:10.1109/BEPRL.2004.1308156

An Bing, Zheng Zonglin, Wu Feng-shun, Lu Jun, Z. Xiaodong, Wu Yiping

引用次数: 5

Abstract

A dynamic model for evaluating the reflow characteristics of solder pastes is developed. The model is based on a solder paste - solder ball test (IPC-TM-650 2.4.43). The process of this test can be divided into four sequent stages: solvent effusion and volatilization, solder paste pattern shrinkage, solder ball shrinkage, and stabilization. Another bubbling stage is separated alone, because it occurs erratically. All these stages are associated with defects and their possible reasons are described and discussed. It is found that the shrinking behavior and bubbling process are two key points in the reflow process. Fast and stable shrinking, and exhaustive escaping of bubbles, are helpful to reduce the reflow defects.

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用焊锡球试验分析焊锡回流的动态行为

建立了评价锡膏回流特性的动态模型。该模型基于锡膏-锡球试验(IPC-TM-650 2.4.43)。该测试过程可分为四个阶段:溶剂渗出和挥发、锡膏图案收缩、锡球收缩和稳定。另一个冒泡阶段是单独分开的，因为它的发生是不规律的。所有这些阶段都与缺陷有关，并描述和讨论了它们的可能原因。研究发现，收缩行为和鼓泡过程是回流过程中的两个关键点。快速稳定的收缩，气泡的彻底逸出，有助于减少回流缺陷。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)

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