Temperature sensors modeling for smart power ICs

Abstract

The computational model of the temperature sensors integrated on the IC chip with power transistors is developed. The 2D/3D problem of sensor placement is mathematically described by the classic heat transfer equation coupled with the equation for current density distribution. It is shown that parasitic effects of sensor current displacement and thermo-emf generation resulting from a temperature gradients (Seebeck effect) must be taken into account. For this purpose the special differential equation is introduced. The examples of point- and strip-like temperature sensors modeling for power BJTs and ICs are demonstrated.