Mixed-signal verification methods for multi-power mixed-signal System-on-Chip (SoC) design

Chao Liang
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引用次数: 12

Abstract

Mixed-signal design becomes more and more popular nowadays because designers are required to quickly integrate IPs, control blocks, functional blocks, and analog modules together and run through the design flow to tape out in short time. Given that the latest designs are becoming more and more complex, the increasing physical effects in advanced process nodes, and request for shorter time to market, a fast and accurate design flow will be critical to ensure the success of the project. This paper will briefly describe various mixed signal verification methods used at Freescale Kinetis MCU which include behavior modeling, AMS validation, connectivity verification, mixed-signal Verification IP (VIP), multi-power verification, SoC transistor level simulation and mixed signal functional coverage. Engineering results are discussed to demonstrate the effectiveness of those methods.
多功率混合信号片上系统(SoC)设计中的混合信号验证方法
混合信号设计越来越受欢迎,因为设计人员需要快速集成ip,控制块,功能块和模拟模块,并在短时间内运行设计流程。考虑到最新的设计变得越来越复杂,先进工艺节点的物理效应越来越大,并且要求更短的上市时间,快速准确的设计流程将是确保项目成功的关键。本文将简要介绍飞思卡尔Kinetis MCU中使用的各种混合信号验证方法,包括行为建模,AMS验证,连接性验证,混合信号验证IP (VIP),多电源验证,SoC晶体管级仿真和混合信号功能覆盖。工程结果证明了这些方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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