Low-voltage on-chip cache architecture using heterogeneous cell sizes for high-performance processors

H. Ghasemi, S. Draper, N. Kim
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引用次数: 31

Abstract

To date dynamic voltage/frequency scaling (DVFS) has been one of the most successful power-reduction techniques. However, ever-increasing process variability reduces the reliability of static random access memory (SRAM) at low voltages. This limits voltage scaling to a minimum operating voltage (VDDMIN). Larger SRAM cells, that are less sensitive to process variability, allow the use of lower VDDMIN. However, large-scale memory structures, e.g., the last-level cache (LLC) (that often determines the VDDMIN of the processor), cannot afford to use such large SRAM cells due to the die area constraint. In this paper we propose low-voltage LLC architectures that exploit 1) the DVFS characteristics of workloads running on high-performance processors, 2) the trade-off between SRAM cell size and VDDMIN, and 3) the fact that at lower voltage/frequency operating states the negative performance impact of having a smaller LLC capacity is reduced. Our proposed LLC architectures provide the same maximum performance and VDDMIN as the conventional architecture, while reducing the total LLC cell area by 15%–19% with negligible average runtime increase.
使用异构单元尺寸的高性能处理器的低压片上缓存架构
到目前为止,动态电压/频率缩放(DVFS)是最成功的降功耗技术之一。然而,不断增加的过程可变性降低了静态随机存取存储器(SRAM)在低电压下的可靠性。这限制了电压缩放到最小工作电压(VDDMIN)。较大的SRAM单元,对过程可变性不太敏感,允许使用较低的VDDMIN。然而,由于芯片面积的限制,大型存储结构,例如最后一级缓存(LLC)(通常决定处理器的VDDMIN)无法使用如此大的SRAM单元。在本文中,我们提出了低压LLC架构,利用1)在高性能处理器上运行的工作负载的DVFS特性,2)SRAM单元大小和VDDMIN之间的权衡,以及3)在较低电压/频率工作状态下,具有较小LLC容量的负面性能影响被减少的事实。我们提出的LLC架构提供了与传统架构相同的最大性能和VDDMIN,同时将LLC单元总面积减少了15%-19%,平均运行时间增加可以忽略不计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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