Thick printed copper conductors on alumina substrates

Abstract

This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.