PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions

Abstract

As large-scale integrated circuits have become increasingly powerful, the power consumption of products has gradually increased, which has caused the temperature on PCB to rise and further aggravated the signal integrity problems in high-speed digital systems. Therefore, it is essential to analyze and solve those problems caused by the thermal effect on the PCB. This paper briefly overviewed the progress and future directions of thermal & signal integrity/power integrity (SI/PI) co-analysis, analyzed the measurement techniques of the dielectric properties of laminate materials, and discussed the influence of temperature on high-speed PCB transmission performance.