An integrated patch-clamp amplifier for ultra-low current measurement on solid-state nanopore

Jungsuk Kim, G. Wang, W. Dunbar, K. Pedrotti
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引用次数: 14

Abstract

In this paper, an integrated low-noise patch-clamp amplifier for a solid-state nanopore application is proposed which is composed of three stages: 1) a trans-impedance amplifier (TIA), 2) a voltage-gain amplifier (VGA), and 3) a unity-gain buffer. Because the first stage amplifier makes dominant impacts on gain, bandwidth, noise, stability, and area of the patch-clamp amplifier, in this work, we present the design analysis for the TIA and its optimal feedback resistance. The proposed patch-clamp amplifier has a maximum gain of 152.2dBΩ, an input-referred noise of 11.3pARMS within bandwidth of 10 KHz, and occupies an active die-area of 0.0625mm2. This amplifier is under fabrication in a 0.35μm CMOS 4M2P Process.
一种用于固态纳米孔超低电流测量的集成膜片钳放大器
本文提出了一种用于固态纳米孔应用的集成低噪声膜片钳放大器,该放大器由三级组成:1)跨阻抗放大器(TIA), 2)电压增益放大器(VGA)和3)单位增益缓冲器。由于第一级放大器对膜片箝位放大器的增益、带宽、噪声、稳定性和面积有主要影响,在本工作中,我们提出了TIA及其最佳反馈电阻的设计分析。所提出的膜片钳放大器的最大增益为152.2dBΩ,在10 KHz带宽内的输入参考噪声为11.3pARMS,并占用0.0625mm2的有效模面积。该放大器采用0.35μm CMOS 4M2P工艺制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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