Technical issues with multichip module packaging

Abstract

It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed.<>