Electro-thermo-mechanical Contact Analysis Considering Temperature Dependent Material Properties and Electrical Contact Resistance Determination

S. Saha, Samuel Wynne, R. Jackson
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引用次数: 3

Abstract

Electrical contact mechanics behaves in a complex way and the effect of temperature makes the contact behavior more complicated. To analyze the temperature dependent contact behavior an axisymmetric sinusoidal asperity model of tin has been developed using Finite Element method. The axisymmetric sinusoidal model reduces computational expenses and can effectively consider the asperity interaction, which is an important factor for large elastic-plastic deformation. The model considers temperature dependent yield strength, thermal conductivity and resistivity. Effect of thermal expansion co-efficient is also included. For material modeling, Johnson-Cook material model has been used which can model the temperature dependent material behavior from room temperature to melting temperature. Results show that temperature dependent resistivity and thermal conductivity are the key factors that govern the contact mechanism and temperature dependent yield strength has negligible effect on the electrical contact behavior. The finite element results have been validated comparing the results with the closed form solutions available for voltage-temperature relation. Later an equation has been suggested for the electrical contact resistance (ECR) determination, modifying the current equation derived by Greenwood and Williamson. The equation should be able to predict the contact resistance from room temperature to high temperature cases.
考虑温度相关材料特性的电-热-机械接触分析和电接触电阻测定
电接触力学行为复杂,温度的影响使接触行为更加复杂。为了分析锡的温度随接触行为,采用有限元方法建立了锡的轴对称正弦凹凸度模型。轴对称正弦模型减少了计算量,并能有效地考虑粗糙体相互作用,而粗糙体相互作用是造成大弹塑性变形的重要因素。该模型考虑了与温度相关的屈服强度、导热系数和电阻率。还考虑了热膨胀系数的影响。对于材料建模,Johnson-Cook材料模型可以模拟从室温到熔化温度的温度相关材料行为。结果表明,温度相关的电阻率和导热系数是决定接触机制的关键因素,温度相关的屈服强度对电接触行为的影响可以忽略不计。将有限元计算结果与电压-温度关系的封闭解进行了比较,验证了有限元计算结果的正确性。后来,在修正Greenwood和Williamson导出的电流方程的基础上,提出了一个确定接触电阻(ECR)的方程。该方程应能预测从室温到高温情况下的接触电阻。
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