Laser-based soldering technique for hermetical sealing of the calibration target for the Exomars' Raman instrument

Abstract

We propose the laser-based Solderjet Bumping as a full inorganic joining technique for the hermetical sealing of a possible calibration target container for the ExoMars Raman Laser Spectrometer. This technique allows the adhesive free bonding in a flux free and localized soldering process. We show a finite elements analysis based optimization of a soldering adapted design for the calibration target container. Current experimental results document hermetical sealing of a stainless steel tube with BK7 and D263 windows with a helium leakage rate down to 5 · 10−6 mbarls−1.