Heat Transfer Comparative Analysis: Straight Channel and Dimple-Protrusion Overlapping with Copper Oxide Nano-Particles

Abstract

Modifying the surface of tubes to improve heat transfer is a popular practice all over the world. Grooves, dimples, protrusions, and corrugations are being used to improve the inside and outside surfaces of tubes and channels. Different channels are being used in the electronics such as the channels in the microprocessor for heat exchange. These channels are differentiated based on their shapes and coolants used in them. These heat channels minimize the losses that occurred due to the heating up of devices. This research presents a numerical study and comparative analysis of heat transfer and flows characteristics with different pipe geometries with the addition of nanoparticles. A simulation-based software is used for changing the geometry of channels and concentration of nanoparticles in flowing fluid to make a comparative analysis of straight and dimple-protrusion overlapped technology. The rate of heat transfer is used to make this distinction. The nanoparticles of Copper oxide with a concentration of 2% and 4% are added in fluid and a maximum increment of 15% is obtained in Nusselt Number.