Robust design of CMOS wireless SoC for 3D-integrated small transferjet™ module

Abstract

TransferJet™ is an emerging high-speed close-proximity wireless communication standard, which enables a data transfer of up to 522 Mbps within a few centimeters transmission range. We have designed a fully integrated TransferJetTM SoC with a 4.48-GHz operating frequency and a 560-MHz signal bandwidth using a 65 nm CMOS technology. A module has also been developed employing 3D integration technology. The SoC with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a module size of 4.8 mm × 4.8 mm × 1.0 mm. Since RF signals are sensitive to the low height and small footprint of the module, we propose a waveform pre-emphasis scheme to handle the ultra-wide bandwidth and a programmable power attenuator for precise output power in the transmitter of the SoC to meet the TransferJetTM standard.