Three-dimensional FEM simulations of thermomechanical stresses in 1.55 /spl mu/m laser modules

Y. Deshayes, L. Bechoul, Y. Danto
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引用次数: 0

Abstract

Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 /spl mu/m laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.
1.55 /spl mu/m激光模组的三维有限元模拟
利用有限元法对通信用直接调制1.55 /spl μ m激光模块进行非线性热力学模拟。在本文中,将发展两个主要部分:基于整个激光模块(结构设计,不同材料,不匹配CTE)的技术和热力学分析的关键区域应力和应变的评估以及计算应变与导致逐渐功率漂移的光学错位之间的关系。实验失效分析也将进行,以验证热力学模拟,特别是集中在激光焊接接头。在这种情况下,必须使用基于ANSYS软件的多物理场计算的原始方法来实现对封装的热、电和热力学模拟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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