A 7nm CMOS platform technology featuring 4th generation FinFET transistors with a 0.027um2 high density 6-T SRAM cell for mobile SoC applications

Shien-Yang Wu, Lin Chih-Yung, M. Chiang, J. Liaw, J. Cheng, S. Yang, C. Tsai, P. Chen, T. Miyashita, Chang-Yun Chang, V. Chang, K. Pan, J. Chen, Y. Mor, K. Lai, C. Liang, Chen Hsin-Chi, S. Chang, Chia-Pin Lin, C. Hsieh, R. F. Tsui, C. Yao, C. C. Chen, R. Chen, C. Lee, Hau-Yu Lin, Chih-Sheng Chang, K. W. Chen, M. Tsai, Kuei-Shun Chen, Y. Ku, S. Jang
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引用次数: 105

Abstract

For the first time, a leading edge 7nm CMOS platform technology for mobile SoC applications is presented. This technology provides >3.3X routed gate density and 35%∼40% speed gain or >65% power reduction over our 16nm FinFET technology. A fully functional 256Mb SRAM test-chip with the smallest high density SRAM cell of 0.027um2 is demonstrated down to 0.5V. The 4th generation FinFET transistors are optimized with device mismatch reduction by 25%∼35% and multi-Vt device options to enable low power and high performance design requirements.
7nm CMOS平台技术,采用第四代FinFET晶体管,具有0.027um2高密度6-T SRAM单元,适用于移动SoC应用
首次提出了用于移动SoC应用的领先7nm CMOS平台技术。与我们的16nm FinFET技术相比,该技术提供了>3.3倍的路由栅极密度和35% ~ 40%的速度增益或>65%的功耗降低。一个全功能的256Mb SRAM测试芯片,最小的高密度SRAM单元为0.027um2,低至0.5V。第四代FinFET晶体管进行了优化,器件失配降低了25% ~ 35%,并提供多vt器件选项,以实现低功耗和高性能设计要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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