TCAD analysis of short-circuit oscillations in IGBTs

P. Diaz Reigosa, F. Iannuzzo, Munaf T. A. Rahimo
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引用次数: 8

Abstract

Insulated-Gate Bipolar Transistors (IGBTs) exhibit a gate-voltage oscillation phenomenon during short-circuit, which can result in a gate-oxide breakdown. The oscillations have been investigated through device simulations and experimental investigations of a 3.3-kV IGBT. It has been found that the oscillations are more likely to occur at low DC-link voltages, high gate voltages and low temperatures due to a charge-storage effect at the surface of the IGBT. Based on this insight, the charge-storage effect can be explained with a reduction in carrier velocity due to the electric field shape rotation during short circuit.
igbt短路振荡的TCAD分析
绝缘栅双极晶体管(igbt)在短路过程中表现出一种栅极电压振荡现象,这种振荡现象可能导致栅极氧化物击穿。通过3.3 kv IGBT的器件模拟和实验研究,对其振荡进行了研究。研究发现,由于IGBT表面的电荷存储效应,在低直流链路电压、高栅极电压和低温下更容易发生振荡。基于这一见解,电荷存储效应可以用短路时电场形状旋转引起的载流子速度降低来解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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