{"title":"How to develop a qualification test plan for RoHS products","authors":"M. Silverman, F. Schenkelberg, C. Hillman","doi":"10.1109/RAMS.2008.4925825","DOIUrl":null,"url":null,"abstract":"The subject matter we consider in this paper are the significant reliability uncertainties around lead-free solder and how to best consider these risks and mitigate them so as not to take a hit in the area of reliability during the lead-free transition. Like the rest of the electronics industry, your products will transition to restriction of hazardous substances (RoHS) compliance. This includes the transition to lead-free solder, and at this time, there are significant reliability uncertainties around lead-free solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. During this time of rapid transition, there is a significant new body of knowledge to understand to determine the areas of greatest risk to the reliability of your product. In this paper, we will highlight a few of these significant risk areas and how to best mitigate these risks during the transition.","PeriodicalId":143940,"journal":{"name":"2008 Annual Reliability and Maintainability Symposium","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Annual Reliability and Maintainability Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RAMS.2008.4925825","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The subject matter we consider in this paper are the significant reliability uncertainties around lead-free solder and how to best consider these risks and mitigate them so as not to take a hit in the area of reliability during the lead-free transition. Like the rest of the electronics industry, your products will transition to restriction of hazardous substances (RoHS) compliance. This includes the transition to lead-free solder, and at this time, there are significant reliability uncertainties around lead-free solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. During this time of rapid transition, there is a significant new body of knowledge to understand to determine the areas of greatest risk to the reliability of your product. In this paper, we will highlight a few of these significant risk areas and how to best mitigate these risks during the transition.