Interconnect networks for resistive computing architectures

Hoang Anh Du Nguyen, Lei Xie, Jintao Yu, M. Taouil, S. Hamdioui
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引用次数: 4

Abstract

Today's computing systems suffer from a memory/communication bottleneck, resulting in high energy consumption and saturated performance. This makes them inefficient in solving data-intensive applications at reasonable cost. Computation-In-Memory (CIM) architecture, based on the integration of storage and computation in the same physical location using non-volatile memristor crossbar technology, offers a potential solution to the memory bottleneck. An efficient interconnect network is essential to maximize CIM's architectural performance. This paper presents three interconnect network schemes for CIM architecture; these are (1) CMOS-based, (2) memristor-based and (3) hybrid cmos/memristor interconnect network scheme. To illustrate the feasibility of such schemes, a CIM parallel adder is used as a case study. The results show that the hybrid interconnect network scheme achieves a higher performance in comparison with the CMOS-based and memristor-based interconnect scheme in terms of delay, energy and area.
用于电阻计算架构的互连网络
当今的计算系统受到内存/通信瓶颈的困扰,导致高能耗和饱和性能。这使得它们在以合理的成本解决数据密集型应用程序时效率低下。内存计算(CIM)体系结构基于使用非易失性忆阻交叉棒技术在同一物理位置集成存储和计算,为内存瓶颈提供了一种潜在的解决方案。高效的互连网络对于最大化CIM的架构性能至关重要。提出了三种用于CIM体系结构的互连网络方案;这些是(1)基于cmos,(2)基于忆阻器和(3)混合cmos/忆阻器互连网络方案。为了说明这些方案的可行性,本文以CIM并行加法器为例进行了研究。结果表明,与基于cmos和忆阻器的互连方案相比,混合互连网络方案在延迟、能量和面积方面具有更高的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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