Temperature-to-power mapping

Zhenyu Qi, B. Meyer, Wei Huang, R. J. Ribando, K. Skadron, M. Stan
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引用次数: 25

Abstract

Accurate power maps are useful for power model validation, process variation characterization, leakage estimation, and power optimization, but are hard to measure directly. Deriving power maps from measured thermal maps is the inverse problem of the power-to-temperature mapping, extensively studied through thermal simulation. Until recently this inverse heat conduction problem has received little attention in the microarchitecture research community. This paper first identifies the source of difficulties for the problem. The inverse mapping is then performed by applying constraints from microarchitecture-level observations. The inherent large sensitivity of the resultant power map is minimized through thermal map-filtering and constrained least-squares optimization. Choices of filter parameters and optimization constraints are investigated and their effects are evaluated. Furthermore, the paper highlights the differences between the grid and block modeling in the inverse mapping which were often ignored by previous schemes. The proposed methods reduce the mapping error by more than 10× compared to unoptimized solutions. To our best knowledge this is the first work to quantitatively evaluate and minimize the noise effect in the temperature to power mapping problem at the microarchitecture level for both grid and block mode, and for the steady and transient case.
Temperature-to-power映射
准确的功率图对功率模型验证、工艺变化表征、泄漏估计和功率优化很有用,但很难直接测量。从测得的热图推导功率图是功率-温度映射的逆问题,通过热模拟得到了广泛的研究。直到最近,这一逆热传导问题在微体系结构研究界还很少受到关注。本文首先确定了问题的难点来源。然后通过应用来自微架构级观察的约束来执行反向映射。通过热图滤波和约束最小二乘优化,最大限度地降低了功率图固有的大灵敏度。研究了滤波器参数的选择和优化约束,并对其效果进行了评价。此外,本文还强调了网格建模和块建模在逆映射中的区别,而这些区别往往被以往的方法所忽略。与未优化解相比,所提方法将映射误差降低了10倍以上。据我们所知,这是第一次在微架构水平上定量评估和最小化温度到功率映射问题中的噪声影响,包括网格和块模式,以及稳态和瞬态情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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