H. Aoki, H. Sakairi, N. Kuroda, Yohei Nakamura, K. Chikamatsu, K. Nakahara
{"title":"AlGaN/GaN MIS HEMT Modeling of Frequency Dispersion and Self-Heating Effects","authors":"H. Aoki, H. Sakairi, N. Kuroda, Yohei Nakamura, K. Chikamatsu, K. Nakahara","doi":"10.1109/RFIT.2018.8524087","DOIUrl":null,"url":null,"abstract":"A compact model of AlN/GaN metal-insulator-semiconductor (MIS)-HEMTs which supports DC and small-signal AC with self-heating and frequency dispersion effects is developed. The model is implemented in Verilog-A source codes. The model parameters are extracted from measured data of the G-S-G transistor test structures that we fabricated. Both of self-heating and frequency dispersion characteristics are successfully handled in the model. The results show good agreements between device measurements and simulations.","PeriodicalId":297122,"journal":{"name":"2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT.2018.8524087","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A compact model of AlN/GaN metal-insulator-semiconductor (MIS)-HEMTs which supports DC and small-signal AC with self-heating and frequency dispersion effects is developed. The model is implemented in Verilog-A source codes. The model parameters are extracted from measured data of the G-S-G transistor test structures that we fabricated. Both of self-heating and frequency dispersion characteristics are successfully handled in the model. The results show good agreements between device measurements and simulations.