A ReRAM integrated 7T2R non-volatile SRAM for normally-off computing application

S. Sheu, Chia-Chen Kuo, Meng-Fan Chang, P. Tseng, L. Chih-Sheng, Min-Chuan Wang, Chih-He Lin, Wen-Pin Lin, Tsai-Kan Chien, Sih-Han Lee, Szu-Chieh Liu, Heng-Yuan Lee, Pang-Shiu Chen, Yu-Sheng Chen, Ching-Chih Hsu, Frederick T. Chen, K. Su, T. Ku, M. Tsai, M. Kao
{"title":"A ReRAM integrated 7T2R non-volatile SRAM for normally-off computing application","authors":"S. Sheu, Chia-Chen Kuo, Meng-Fan Chang, P. Tseng, L. Chih-Sheng, Min-Chuan Wang, Chih-He Lin, Wen-Pin Lin, Tsai-Kan Chien, Sih-Han Lee, Szu-Chieh Liu, Heng-Yuan Lee, Pang-Shiu Chen, Yu-Sheng Chen, Ching-Chih Hsu, Frederick T. Chen, K. Su, T. Ku, M. Tsai, M. Kao","doi":"10.1109/ASSCC.2013.6691028","DOIUrl":null,"url":null,"abstract":"This study demonstrates a new 7T2R nonvolatile SRAM (nvSRAM) with 3D ReRAM stacked structure for normally-off computing application. With this structure, the fully performance of SRAM can work well in active mode, and reduce the leakage current in power-off mode. High performance HfOx based ReRAM is used for high speed storage element and exhibits an instant-on characteristic. The present 7T2R nvSRAM cell includes a 1T2R RRAM (1 transistor/2 resistive memory) cell and a 6T SRAM circuit, which is low area penalty and achieve the nvSRAM function. The write margin is improved over 1.03x and 1.37x larger than that of 6T SRAM and 6T2R nvSRAM. The access time and read/write power consumption in 7T2R nvSRAM is better than that of 8T2R structure. Finally, a 16 Kb macro was fabricated with a 0.18 μm TSMC FEOL and ITRI BEOL. According to the measurement result, the VDDmin can be low down to 0.7 V and access time can be fast as 8.3 ns without pad delay. The data storage time is only 10 ns for SET and RESET in the ReRAM cell.","PeriodicalId":296544,"journal":{"name":"2013 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"2007 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE Asian Solid-State Circuits Conference (A-SSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2013.6691028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 36

Abstract

This study demonstrates a new 7T2R nonvolatile SRAM (nvSRAM) with 3D ReRAM stacked structure for normally-off computing application. With this structure, the fully performance of SRAM can work well in active mode, and reduce the leakage current in power-off mode. High performance HfOx based ReRAM is used for high speed storage element and exhibits an instant-on characteristic. The present 7T2R nvSRAM cell includes a 1T2R RRAM (1 transistor/2 resistive memory) cell and a 6T SRAM circuit, which is low area penalty and achieve the nvSRAM function. The write margin is improved over 1.03x and 1.37x larger than that of 6T SRAM and 6T2R nvSRAM. The access time and read/write power consumption in 7T2R nvSRAM is better than that of 8T2R structure. Finally, a 16 Kb macro was fabricated with a 0.18 μm TSMC FEOL and ITRI BEOL. According to the measurement result, the VDDmin can be low down to 0.7 V and access time can be fast as 8.3 ns without pad delay. The data storage time is only 10 ns for SET and RESET in the ReRAM cell.
一种集成7T2R非易失SRAM的rram,用于正常关闭计算应用
本研究展示了一种具有3D ReRAM堆叠结构的新型7T2R非易失性SRAM (nvSRAM),用于正常关闭计算应用。这种结构使SRAM在有源模式下能充分发挥其性能,在断电模式下能减小漏电流。基于HfOx的高性能ReRAM用于高速存储元件,具有瞬时开启特性。目前的7T2R nvSRAM单元包括一个1T2R RRAM(1晶体管/2电阻存储器)单元和一个6T SRAM电路,该电路具有低面积损耗和实现nvSRAM功能。与6T SRAM和6T2R nvSRAM相比,写空间分别提高了1.03倍和1.37倍。7T2R结构的访问时间和读写功耗优于8T2R结构。最后,用0.18 μm TSMC FEOL和ITRI BEOL制备了16 Kb的宏。根据测量结果,VDDmin可低至0.7 V,访问时间可快至8.3 ns,无焊盘延迟。在ReRAM单元中,SET和RESET的数据存储时间仅为10 ns。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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