Replacing global wires with an on-chip network: a power analysis

Seongmoo Heo, K. Asanović
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引用次数: 68

Abstract

This paper explores the power implications of replacing global chip wires with an on-chip network. The authors optimized the network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. An analytic model of large chip designs with an on-chip two-dimensional mesh network was developed and the power savings possible in a 70 nm process for two different design points: a circuit-switched ASIC or FPGA design, and a dynamic packet-switched tiled architecture were estimated. For circuit-switched networks, achievable power savings are 35-50% for a mesh with 1 mm links. The packet switched designs use multiplexing and signal encoding to reduce the number of link wires required, but the router overhead limits peak wire power savings to around 20% with optimal tile sizes of around 2 mm.
用片上网络代替全球电线:功率分析
本文探讨了用片内网络取代全球芯片线的功率含义。作者通过改变中继器间距、链路管道和电压缩放来优化网络链路,以显着减少跨芯片发送比特的能量。建立了基于片上二维网格网络的大型芯片设计的分析模型,并对电路交换ASIC或FPGA设计和动态分组交换平铺结构两种不同设计点在70 nm工艺中可能节省的功耗进行了估计。对于电路交换网络,对于1毫米链路的网格,可实现的功耗节省为35-50%。分组交换设计使用多路复用和信号编码来减少所需的链路数量,但路由器开销限制了峰值线功率节约约20%,最佳瓦片尺寸约为2毫米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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