Management of air conditioning system in electronics housing by using thermoelectric Peltier module

THE 7TH INTERNATIONAL CONFERENCE ON ENGINEERING, APPLIED SCIENCES AND TECHNOLOGY: (ICEAST2021) Pub Date : 2021-09-15 DOI:10.1063/5.0064404

A. Suriyawong, S. Saisorn, N. Suwanpayak, S. Wongwises

{"title":"Management of air conditioning system in electronics housing by using thermoelectric Peltier module","authors":"A. Suriyawong, S. Saisorn, N. Suwanpayak, S. Wongwises","doi":"10.1063/5.0064404","DOIUrl":null,"url":null,"abstract":"The study was the conditioning system of the electronic case by using thermoelectric Peltier module. The Peltier module is used based on the temperature difference of the hot and cold sides, with input electric power in the thermoelectric Peltier module. The hot side of the Peltier module was installed on a side of the heat sinks with heat removing from a Peltier module into a surrounding while the cold side of the Peltier module was installed on the other side of the heat sinks with the heat absorption of the computer case. The electronic case volume is 450x395x240 mm³. The device of cooling loads was installed in the electronic case. The cooling loads were tested with various power of 0, 60, 120, 180, and 240 Watt. The results indicated that the coefficient of performance (COP) increased with the cooling load. Furthermore, the experimental results indicated that the temperature inside the electronic case increased with cooling load because the temperature of the electronic case increased with decreasing the temperature difference between the hot and the cold sides.","PeriodicalId":445992,"journal":{"name":"THE 7TH INTERNATIONAL CONFERENCE ON ENGINEERING, APPLIED SCIENCES AND TECHNOLOGY: (ICEAST2021)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"THE 7TH INTERNATIONAL CONFERENCE ON ENGINEERING, APPLIED SCIENCES AND TECHNOLOGY: (ICEAST2021)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/5.0064404","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

Abstract

The study was the conditioning system of the electronic case by using thermoelectric Peltier module. The Peltier module is used based on the temperature difference of the hot and cold sides, with input electric power in the thermoelectric Peltier module. The hot side of the Peltier module was installed on a side of the heat sinks with heat removing from a Peltier module into a surrounding while the cold side of the Peltier module was installed on the other side of the heat sinks with the heat absorption of the computer case. The electronic case volume is 450x395x240 mm³. The device of cooling loads was installed in the electronic case. The cooling loads were tested with various power of 0, 60, 120, 180, and 240 Watt. The results indicated that the coefficient of performance (COP) increased with the cooling load. Furthermore, the experimental results indicated that the temperature inside the electronic case increased with cooling load because the temperature of the electronic case increased with decreasing the temperature difference between the hot and the cold sides.

查看原文本刊更多论文

热电珀尔帖模块在电子住宅空调系统管理中的应用

研究了采用热电珀尔帖模块的电子机箱调节系统。珀尔帖模块是根据冷热侧温差使用的，输入电能在热电珀尔帖模块中。珀尔帖模块的热侧安装在散热器的一侧，热量从珀尔帖模块排出到周围环境中，而珀尔帖模块的冷侧安装在散热器的另一侧，通过计算机机箱的吸热。电子机箱体积450x395x240mm³。在电子机箱中安装了冷负荷装置。分别在0、60、120、180、240瓦的不同功率下进行冷负荷测试。结果表明，随着制冷负荷的增加，制冷性能系数(COP)逐渐增大。此外，实验结果表明，随着冷、热侧温差的减小，电子机箱内部温度随冷负荷的增加而升高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

THE 7TH INTERNATIONAL CONFERENCE ON ENGINEERING, APPLIED SCIENCES AND TECHNOLOGY: (ICEAST2021)

自引率

0.00%

发文量