Basic evaluation of Au micro-bumps formed by cyanide-free electroless Au plating process

Abstract

We conducted a basic evaluation of Au micro-bumps formed by cyanide-free electroless Au plating. The Au micro-bump diameter was approximately 10 μm. Bump height measurement, bump shear testing, and X-ray photoelectron spectroscopy of the Au surface were performed after Au micro-bump formation. Scanning ion microscope observation of the bonding interface, chip shear testing, four-terminal measurement, and daisy chain measurement were performed after flip-chip bonding. The results show that the Au micro-bumps have good mechanical and electrical properties.