J. Yousaf, J. Han, H. Lee, W. Nah, J. Youn, S. Mun, D. Lee, C. Hwang
{"title":"Fast Characterization of System Level ESD Noise Coupling to Real Motherboard in Notebook","authors":"J. Yousaf, J. Han, H. Lee, W. Nah, J. Youn, S. Mun, D. Lee, C. Hwang","doi":"10.1109/EMCEUROPE.2018.8485035","DOIUrl":null,"url":null,"abstract":"This work presents a method for the fast and efficient characterization of the system level electrostatic discharge (ESD) noise coupling to real portable computer (note-book) motherboard. The coupled noise to the commercial laptop motherboard, in both operational and non-operational conditions, is predicted in SPICE type circuit simulator using the derived coupling transfer impedance function from scattering (S) parameters. 8-parameters between the aggressor and victim positions are measured using the proposed different method, without any modification in ESD generator, for the calculation of the coupling transfer impedance function. A good degree of accuracy is observed between the time domain measured and simulated results using proposed method.","PeriodicalId":376960,"journal":{"name":"2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE)","volume":"334 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCEUROPE.2018.8485035","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This work presents a method for the fast and efficient characterization of the system level electrostatic discharge (ESD) noise coupling to real portable computer (note-book) motherboard. The coupled noise to the commercial laptop motherboard, in both operational and non-operational conditions, is predicted in SPICE type circuit simulator using the derived coupling transfer impedance function from scattering (S) parameters. 8-parameters between the aggressor and victim positions are measured using the proposed different method, without any modification in ESD generator, for the calculation of the coupling transfer impedance function. A good degree of accuracy is observed between the time domain measured and simulated results using proposed method.