D-band Free Space Dielectric Characterization of a Low-Cost Ultradense Microdiamond Composite for Heat Spreading

Shu-Ming Chang, Chelsea Swank, A. Kummel, M. Bakir, M. Rodwell, Jim Buckwalter
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Abstract

Low-cost dielectric materials are needed above 100 GHz with low permittivity and loss tangent as well as significant thermal conductivity $(\sim 100W/m\cdot K)$. A free-space measurement setup is demonstrated to characterize a proposed ultradense diamond composite material at D-band. We leverage free-space calibration with the NIST iterative method to extract the permittivity and loss tangent and compare this approach with other methods. Time-domain gating is employed to reduce the uncertainty in the free space characterization. Our measurement indicates the diamond composite offers a relative permittivity of 3.5 and loss tangent of $3\times 10^{-2}$ from 110-140 GHz. To the author’s knowledge, this is the first report of diamond composite compatible with packaging requirements at D-band.
低成本超致密微金刚石复合材料热扩散的d波段自由空间介电特性
在100ghz以上需要低成本的介电材料,具有低介电常数和损耗正切以及显著的导热系数$(\sim 100W/m\cdot K)$。利用自由空间测量装置在d波段对所提出的超致密金刚石复合材料进行了表征。我们利用NIST迭代法的自由空间校准来提取介电常数和损耗正切,并将该方法与其他方法进行比较。采用时域门控来降低自由空间表征中的不确定性。我们的测量表明,金刚石复合材料在110-140 GHz范围内的相对介电常数为3.5,损耗正切为3\乘以10^{-2}$。据笔者所知,这是首次报道符合d波段包装要求的金刚石复合材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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