{"title":"Assembly, packaging, power, and thermal management","authors":"J. Williams","doi":"10.1049/sbra526e_ch15","DOIUrl":null,"url":null,"abstract":"The previous chapters have dealt mainly with performance in terms of antenna beam characteristics and quality. This chapter deals with the necessary provisions and infrastructure for the ESA to perform to its potential at the lowest cost. There are a few papers covering the general subject including Kemkemian et al. and Renard et al.","PeriodicalId":169603,"journal":{"name":"Electronic Scanned Array Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Scanned Array Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/sbra526e_ch15","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The previous chapters have dealt mainly with performance in terms of antenna beam characteristics and quality. This chapter deals with the necessary provisions and infrastructure for the ESA to perform to its potential at the lowest cost. There are a few papers covering the general subject including Kemkemian et al. and Renard et al.