1/f Noise Analysis of a 75 nm Twin-Flash Technology Non-Volatile Memory Cell

G. Krause, K. Hofmann, M. F. Beug, T. Muller
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引用次数: 1

Abstract

Analyzing the electrical degradation of modern flash memory cells by conventional C-Vor charge pumping techniques is hardly possible due to the extremely small gate area. However, 1/f noise measurements can be done since low frequency 1/f noise in the range around 1 Hz produced by stress-generated oxide traps strongly increases in MOSFETs with shrinking area. Here we show that measurements of the noise power spectral density enable the investigation of the degradation of the devices caused by hot carrier stress during write/erase cycling. In particular, we demonstrate that the oxide trap generation of a multi-bit cell like the Twin-FlashTM cell is mainly located at the stressed bit region.
1/f 75 nm双闪技术非易失性存储单元噪声分析
由于栅极面积极小,传统的C-Vor电荷泵送技术很难分析现代快闪存储单元的电退化。然而,可以进行1/f噪声测量,因为应力产生的氧化物陷阱在1 Hz左右范围内产生的低频1/f噪声在mosfet中随着面积的缩小而强烈增加。在这里,我们表明噪声功率谱密度的测量能够研究器件在写/擦除循环期间由热载流子应力引起的退化。特别是,我们证明了像Twin-FlashTM电池这样的多比特电池的氧化阱主要位于应力位区域。
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