A dynamic temperature control simulation system for FPGAs

Shilpa Bhoj, D. Bhatia
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引用次数: 3

Abstract

Rapid increases in transistor density, clock speeds and competition with custom ICs have escalated the demand for aggressive solutions to battle rising operating temperatures in programmable fabrics. In this work, we make several key contributions to temperature management in FPGAs. We develop a novel and robust simulation framework exploring adaptive techniques to reduce on chip temperatures in the reconfigurable core. We implement a thermal driven voltage scaling algorithm based on temperature and performance feedback. Our performance estimation model is an accurate empirical relation between delay, supply voltage and temperature with an average error of 9%. Our final results show significant temperature reductions of up to 13.37degC accompanied by the added benefit of power savings averaging 13.48%. Overheads are limited to an average reduction in worst case operating frequency of 10.78% and a voltage swing of 0.61V.
基于fpga的动态温度控制仿真系统
晶体管密度、时钟速度的快速增长,以及与定制ic的竞争,使得对激进解决方案的需求升级,以应对可编程结构中不断上升的工作温度。在这项工作中,我们对fpga的温度管理做出了几项关键贡献。我们开发了一种新颖而强大的仿真框架,探索自适应技术来降低可重构核心的芯片温度。我们实现了一种基于温度和性能反馈的热驱动电压缩放算法。我们的性能估计模型是延迟、电源电压和温度之间准确的经验关系,平均误差为9%。我们的最终结果显示,温度降低了13.37摄氏度,同时平均节省了13.48%的电力。开销限制在最坏情况下平均降低10.78%的工作频率和0.61V的电压摆动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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