Advances and Challenges in Flip-Chip Packaging

IEEE Custom Integrated Circuits Conference 2006 Pub Date : 2006-09-01 DOI:10.1109/CICC.2006.320896

R. Mahajan, D. Mallik, Robert Sankman, K. Radhakrishnan, C. Chiu, J. He

引用次数: 10

Abstract

The role of semiconductor packaging has evolved from space transformation and environmental protection, to becoming an important enabler for silicon and system performance. This paper examines some of the advances in flip-chip packaging as an enabler of power delivery and power removal using a microprocessor as an example. In addition, the role of the package as an enabler of system I/O performance and silicon back-end reliability will be examined

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倒装芯片封装的进展与挑战

半导体封装的作用已经从空间改造和环境保护发展成为硅和系统性能的重要推动者。本文以微处理器为例，研究了倒装芯片封装作为功率传输和功率去除的推动者的一些进展。此外，还将研究封装作为系统I/O性能和硅后端可靠性的推动者的作用

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Custom Integrated Circuits Conference 2006

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