Impact of self-heating on reliability predictions in STT-MRAM

S. Van Beek, B. O’Sullivan, P. Roussel, R. Degraeve, E. Bury, J. Swerts, S. Couet, L. Souriau, S. Kundu, S. Rao, W. Kim, F. Yasin, D. Crotti, D. Linten, G. Kar
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引用次数: 14

Abstract

At breakdown conditions, large current flows in STT-MRAM devices. We experimentally show that this large current causes significant self-heating of 200-300°C, which impacts the reliability extrapolation to operating conditions. By measuring and analyzing breakdown at various temperatures and on different MgO thickness, we successfully incorporate self-heating into the breakdown model. We find that the 10 year lifetime is underestimated by a factor 103 at 63-percentile, to even 107 when applying percentile scaling to 1 ppm.
自热对STT-MRAM可靠性预测的影响
在击穿条件下,STT-MRAM器件中有大电流流动。实验表明,这种大电流会导致200-300°C的显著自热,从而影响对运行条件的可靠性外推。通过测量和分析在不同温度和不同MgO厚度下的击穿,我们成功地将自加热纳入击穿模型。我们发现,在63个百分位数时,10年的寿命被低估了103倍,当将百分位数缩放到1ppm时,甚至被低估了107倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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