Position control of SPMSM for wafer process using Sliding Mode Controller

Tae-Bok Jung, Soo-Cheol Shin, Hee-Jun Lee, Chi-Hwan Choi, C. Won, Taeck-Kie Lee
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引用次数: 1

Abstract

This paper present position control method of SPMSM using Improved Sliding Mode Controller (ISMC) which has not only dynamic performance of PI controller but also robust characteristics of sliding mode controller for wafer processing robot. In order to verify performances of proposed position control method, performances of PI controller using decided sliding trajectory by position error, sliding mode control (SMC) that can obtain large torque, and improved sliding mode control is compared. To verify performances, SPMSM that has 200[w] rated power be adopted. Performances of Position controller using ISMC is verified by simulation and experimental results.
用滑模控制器控制晶圆过程中SPMSM的位置
本文提出了一种基于改进滑模控制器(ISMC)的SPMSM位置控制方法,该方法既具有PI控制器的动态性能,又具有硅片加工机器人滑模控制器的鲁棒性。为了验证所提出的位置控制方法的性能,比较了采用位置误差确定滑动轨迹的PI控制器、能够获得大转矩的滑模控制(SMC)和改进的滑模控制的性能。为了验证性能,采用额定功率为200[w]的SPMSM。仿真和实验结果验证了ISMC位置控制器的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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