Fabrication of metal’s nanoparticles in silicon and sapphire by low energy ion implantation

D.Kh. Mirkarimov, T. Radjabov, A. Kamardin, Z. Khakimov
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Abstract

This work devoted to the fabrication of metal nanoparticles in silicon and sapphire by ion implantation and their modification by laser annealing. This approach is promising for the development of optical composite materials in the optoelectronics production technology. Composite layers were fabricated in silicon by implantation of 40-keV Cu+ ions at a dose of 1017 ion/cm2 and an ion beam current density varying from 2.5 to 10 mA/cm2. An interaction of high power excimer laser pulsed with fabricated composite layer aimed to modify the sizes and the size distribution of copper particles. It is found that the laser annealing diminishes nanoparticles in the silicon. Experimental data on laser modification may be explained by photofragmentation and/or melting of the nanoparticles in the silicon.
低能离子注入制备硅和蓝宝石金属纳米粒子
本文研究了离子注入法制备硅和蓝宝石金属纳米粒子及其激光退火修饰。该方法对光学复合材料在光电子生产技术中的发展具有重要意义。以1017离子/cm2的剂量和2.5 ~ 10 mA/cm2的离子束密度注入40 kev的Cu+离子,在硅中制备了复合层。高功率准分子激光脉冲与制备的复合层的相互作用旨在改变铜颗粒的尺寸和尺寸分布。结果表明,激光退火减少了硅中的纳米颗粒。激光改性的实验数据可以用硅中的纳米颗粒的光破碎和/或熔化来解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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