Monolithic integration of III-V microdisk lasers on silicon

S. Mauthe, H. Schmid, K. Moselund, N. V. Triviño, M. Sousa, P. Staudinger, Y. Baumgartner, P. Tiwari, T. Stöferle, D. Caimi, M. Scherrer
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引用次数: 2

Abstract

Local integration of III-V active photonic material on silicon is highly desirable for the dense cointegration of electronics and photonics. In this work, we integrate GaAs and InP microdisk lasers on silicon using template-assisted selective epitaxy (TASE). We demonstrate optically pumped room-temperature lasing from InP hexagonal microdisks integrated via TASE and evaluate their performance at lower temperatures.In order to assess and evaluate the viability of TASE, performance of InP hexagonal microdisks are compared to identical devices fabricated via the highly developed and mature direct wafer bonding technique. The lasing threshold as well as the light-in light-out curves of our TASE structures compare favorably with the bonded InP hexagonal microdisks. This demonstrates that our TASE approach is a promising technique for the monolithic integration of optical devices on Si.
III-V型微磁盘激光器在硅上的单片集成
III-V型有源光子材料在硅上的局部集成对于电子学和光子学的密集协整是非常理想的。在这项工作中,我们使用模板辅助选择性外延(TASE)将GaAs和InP微盘激光器集成在硅上。我们演示了通过TASE集成的InP六边形微盘的室温光泵浦激光,并评估了它们在较低温度下的性能。为了评估和评估TASE的可行性,将InP六方微盘的性能与通过高度发达和成熟的晶圆直接键合技术制造的相同器件进行了比较。我们的TASE结构的激光阈值以及光入光灭曲线与键合的InP六边形微盘相比较具有优势。这表明我们的TASE方法是一种很有前途的技术,用于光学器件在Si上的单片集成。
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