An Electrical Bond Contact-Impedance Model

W. E. Moyer, David G. Lubar
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引用次数: 2

Abstract

A model is presented for the impedance of an electrical bond between two metal surfaces held in mechanical contact. Sample calculations are performed which show that such electrical bonds may be assumed to be purely resistive for frequencies below approximately 1.0 GHz. Measured electrical bond impedance data for selected sample bonds are shown to be in general agreement with this assumption when skin effect and bulk conductor inductance are considered. The predicted bond impedance was found to be a surface phenomenon and is a function of surface properties and contact pressure applied to the faying surfaces.
一个电键接触阻抗模型
提出了两个金属表面机械接触时电键阻抗的模型。样品计算表明,这种电键可以假设为纯电阻频率低于约1.0 GHz。当考虑集肤效应和体导体电感时,所选样品键的测量电键阻抗数据与这一假设基本一致。发现预测的键阻抗是一种表面现象,是表面性质和施加在表面上的接触压力的函数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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