Kilovolt GaN MOSHEMT on silicon substrate with breakdown electric field close to the theoretical limit

M. Tao, Maojun Wang, C. Wen, Jinyan Wang, Y. Hao, Wengang Wu, K. Cheng, B. Shen
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引用次数: 7

Abstract

This work reports a kilovolt and low current collapse normally-off GaN MOSHEMT on silicon substrate. The device with a drift length of 3 μm features a threshold voltage of 1.7 V and an output current of 430 mA/mm at 8 V gate bias. The off-state breakdown voltage (BV) is as high as 1021 V (800 V) defined at a drain leakage criterion of 10 μA/mm with floating (grounded) substrate. The corresponding breakdown electric field is 3.4 MV/cm and the Baliga's figure-of-merit (BFOM) is 1.6 GW/cm2. A small degradation of the dynamic on-resistance (Ron, d) about 30% is observed with a short pulse width of 500 ns and a quiescent drain bias of 60 V. The record value is supposed to benefit from the intrinsic step-graded field plate, high quality LPCVD SÌ3N4 passivation and material optimization of 4.5 μm thick epitaxial layer.
在击穿电场接近理论极限的硅衬底上的千伏GaN MOSHEMT
本工作报道了在硅衬底上的千伏低电流坍塌GaN MOSHEMT。该器件漂移长度为3 μm,阈值电压为1.7 V,栅极偏置为8 V时输出电流为430 mA/mm。在浮动(接地)衬底漏极漏电标准为10 μA/mm时,断态击穿电压(BV)可高达1021 V (800v)。相应的击穿电场为3.4 MV/cm, Baliga的优值(bbfm)为1.6 GW/cm2。在500 ns的短脉冲宽度和60 V的静态漏极偏压下,观察到动态导通电阻(Ron, d)下降了约30%。本征阶跃梯度场板、高质量的LPCVD SÌ3N4钝化和4.5 μm厚外延层的材料优化等因素都有助于实现这一记录值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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