A Power-Efficient Compact Ku-Band System-on-Antenna Module with Chip-First Package Integration

Xenofon Konstantinou, Nicholas Sturim, J. Albrecht, P. Chahal, J. Papapolymerou
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Abstract

This work focuses on the unique capabilities that aerosol jet printing (AJP) provides for manufacturing transmit/receive RF front-end modules for microwave and mm-wave applications. We demonstrate an additively manufactured (AM) transmitter system-on-antenna (SoA) at Ku-band, with the transmitter circuit being fully AM packaged on a conventionally manufactured Vivaldi antenna. The entire package is printed on-antenna via AJP around an amplifier die using a chip-first approach. Our transmit module achieves radiated power levels of 0.4-0.66 W, higher than other Ku-band SoAs in the literature. This work shows it is possible to realize high-functional-density RF front-end modules fully via AJP, overcoming the performance bottlenecks introduced by conventional manufacturing methods and reducing prototyping cost and time.
采用芯片优先封装集成的高效节能ku波段系统-天线模块
这项工作的重点是气溶胶喷射打印(AJP)为制造微波和毫米波应用的发射/接收射频前端模块提供的独特功能。我们演示了ku波段的增材制造(AM)发射机天线系统(SoA),发射机电路完全AM封装在传统制造的Vivaldi天线上。整个封装采用芯片优先的方法,通过AJP围绕放大器芯片在天线上印刷。我们的发射模块达到0.4-0.66 W的辐射功率水平,高于文献中其他ku波段soa。这项工作表明,完全通过AJP实现高功能密度射频前端模块是可能的,克服了传统制造方法带来的性能瓶颈,降低了原型成本和时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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