Effect of thermal incorporation in IR - Drop analysis of multilayered network and its reduction technique

Abstract

The thermal influence of the self-heating (SH) effect in electronic devices on interconnects is explored in this paper. The self-heating effect in these devices will generate greater heat in structures, which may affect interconnect dependability. The RedHawk Tool is used to examine a chip design provided by STMicroelectronics in this study. Temperature variations in distinct metal layers, and self-heating impact are all part of the evaluation. Earlier technology didn't include the delta $T$ modelling in the design which is being considered here. Concept of de-coupling capacitors are employed to reduce power consumption in the design.